Semiconductor Wafer Inc

 

Thermal Oxide Wafer

Thermal oxide or silicon dioxide layer is formed on bare silicon surface at elevated temperature in the presence of an oxidant , the process is called thermal oxidation. Thermal oxide is normally grown in a horizontal tube furnace , at temperature range from 900°C ~ 1200°C , using either a "Wet" or "Dry" growth method .Thermal oxide is a kind of "grown" oxide layer , compared to CVD deposited oxide layer , it has a higher uniformity, and higher dielectric strength , it is an excellent dielectric layer as an insulator . In most silicon- based devices, thermal oxide layer play an important role to pacify the silicon surface , to act as doping barriers and as surface dielectrics .SWI provides thermal oxide wafer in diameter from 2" to 6" , we always choose prime grade and defect free silicon wafer as substrate for growing high  uniformity thermal oxide layer to meet your specific requirements . Contact us for further information on price & delivery time .     
                                                             
 
Thermal oxide thickness
Applications
100 A
150 ~ 500 A
200 ~ 500 A
2000 ~ 5000 A
3000 ~ 10000 A
Tunneling Gates
Gate Oxides
LOCOS Pad Oxide
Masking Oxides
Field Oxides
 
Standard Specifications
Wafer size
50.8 mm , 76.2 mm , 100 mm , 150 mm
Thickness range
100 Å ~ 6 µm
Thickness tolerance
Target thickness +/- 5%
Growth method
Wet oxide or Dry oxide method
Tool
Horizontal tube furnace
Gases
Hydrogen and Oxygen gases
Temperature
900 C ° - 1200 C °
Refractive index
1.456
 
 
Superior quality of products with reliance is our prime consideration.
Feel free to contact us if you need any other assistance about our products .
 
Email : sales.america@semiwafer.com
Email : sales.europe@semiwafer.com
Email : sales.asia@semiwafer.com
Email : sales.taiwan@semiwafer.com
Phone : +886-03-592-7585
Fax : +886-03-516-2843
 
 
 
 
 
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