Semiconductor Wafer Inc

 

 

Sputter Target

 
Semiconductor Wafer, Inc. (SWI ) provides a wide range of sputter target for 
thin film coating application. High purity sputter targets are homogenous ,
 fine grained and high density and can be machined to required dimensions .
We have sold a lot of sputter targets to customers for R&D laboratory or
industry production and have gained a reputation for high performance ,
Contact us for more product informations .
                                                                
 
 
Standard Specifications
Shape
Round
Rectangle
Size
1", 2" , 3" , 4" , 5", 6" , 8"
400 x 400 mm
Thickness
2 mm ~ 70 mm
2 mm ~ 70 mm
Purity
99.9% ~ 99.9999 %
99.9% ~ 99.9999 %
Backing Plate
OFHC Copper
OFHC Copper
 

Manufacture Methods

• Vacuum hot pressing
• Hot isostatic pressing (HIP)
• Cold isostatic pressing (CIP)
• Vacuum sintering
• Powder metallurgy
• Vacuum arc melting (VAM)
• Vacuum induction melting (VIM)
• Forging and Rolling
 

Sputter Target Available

Pure elements
Pure metals
Alloys
Rare earths
Single crystals
Compounds
Ceramics
Oxides
Borides
Carbides
Fluorides
Nitrides
Silicides
Tellurides
Sulfides
 

Bonding & Backing Plate

Indium Metal - We use pure Indium metal as the bonding agent , the melting
point for Indium is 156 °C , this may limit the amount of power during
sputtering process .

Silver Epoxy – We use Ag epoxy as the bonding agent for ceramic target
that require a higher melting point .

Backing Plate – Oxygen free copper is the most common backing plate
material , due to it's excellent thermal properties .

 

Popular Ceramic Targets

Sputter Target

Formula

Purity ( % )

Method

ITO

In2O3 / SnO2

99.99

Hot pressing

IZO

In2O3 / ZnO

99.99

Hot pressing

Aluminum oxide

Al2O3

99.99

Hot pressing

Titanium carbide

TiC

99.90

Hot pressing

BST

BaxSr(1-x)TiO3

99.99

Hot pressing

PZT

Pb(Zr0.52Ti0.48)O3

99.99

Hot pressing

Titanium dioxide

TiO2

99.90

Hot pressing

YBCO

YBa2Cu3Ox

99.99

Hot pressing

YSZ

ZrO2 / Y2O3

99.99

Hot pressing

ZAO

ZnO / Al2O3

99.99

Hot pressing

ZGO

ZnO / Ga2O3

99.99

Hot pressing

Zinc oxide

ZnO

99.99

Hot pressing

 
Impurity Content for ITO Sputter Target

Element

Al

Ba

Cd

Cu

Fe

Ni

Pb

Sb

Si

Zn

Content ( ppm )

5

5

5

10

10

10

10

5

15

5

 

Pure Element Sputter Target

 

Rare Earth Sputter Target

Formula

Purity

Materials

 

Formula

Purity

Materials

Ag

4N

Silver

 

Ce

3N

Cerium

Al

5N

Aluminum

 

Dy

3N

Dysprosium

B

3N

Boron

 

Er

3N

Erbium

Bi

3N

Bismuth

 

Eu

3N

Europium

C

3N

Carbon

 

Gd

3N

Gadolinium

Co

3N

Cobalt

 

Ho

3N

Holmium

Cr

3N

Chromium

 

La

3N

Lanthanum

Cu

4N

Copper

 

Lu

3N

Lutetium

Fe

4N

Iron

 

Nd

3N

Neodymium

Ge

5N

Germanium

 

Pm

3N

Promethium

Hf

3N

Hafnium

 

Pr

3N

Praseodymium

In

4N

Indium

 

Sm

3N

Samarium

Mg

3N

Magnesium

 

Tb

3N

Terbium

Mn

4N

Manganese

 

Tm

3N

Thulium

Mo

4N

Molybdenum

 

Yb

3N

Ytterbium

Nb

3N

Niobium

 

 

 

 

Ni

4N

Nickel

 

 

 

 

Pb

5N

Lead

 

 

 

 

Sb

5N

Antimony

 

 

 

 

Si

5N

Silicon

 

 

 

 

Sn

5N

Tin

 

 

 

 

Ta

3N

Tantalum

 

 

 

 

Te

4N

Tellurium

 

 

 

 

Ti

4N

Titanium

 

 

 

 

V

3N

Vanadium

 

 

 

 

W

3N

Tungsten

 

 

 

 

Y

3N

Yttrium

 

 

 

 

Zn

5N

Zinc

 

 

 

 

Zr

3N

Zirconium

 

 

 

 

 

Applications

• Semiconductor
• Decorative
• Hard coating
• Solar cell
• Optoelectrics
• Flat panel display
• Data storage

   A complete product line of sputter targets ranging from metal to compound to      
 serve the needs of thin film industry .                                                                          

 
 
 
 
 
 
 
 
 
 
 
 
 
 
Semiconductor Wafer, Inc.