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Semiconductor Wafer, Inc. (SWI ) provides a wide range of sputter target for
thin film coating application. High purity sputter targets are homogenous ,
fine grained and high density and can be machined to required dimensions .
We have sold a lot of sputter targets to customers for R&D laboratory or
industry production and have gained a reputation for high performance ,
Contact us for more product informations .
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Standard Specifications
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Shape
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Round
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Rectangle
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Size
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1", 2" , 3" , 4" , 5", 6" , 8"
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400 x 400 mm
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Thickness
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2 mm ~ 70 mm
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2 mm ~ 70 mm
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Purity
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99.9% ~ 99.9999 %
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99.9% ~ 99.9999 %
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Backing Plate
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OFHC Copper
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OFHC Copper
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Manufacture Methods
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Vacuum hot pressing
Hot isostatic pressing (HIP)
Cold isostatic pressing (CIP)
Vacuum sintering
Powder metallurgy
Vacuum arc melting (VAM)
Vacuum induction melting (VIM)
Forging and Rolling
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Sputter Target Available
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Pure elements
Pure metals
Alloys
Rare earths
Single crystals
Compounds
Ceramics
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Oxides
Borides
Carbides
Fluorides
Nitrides
Silicides
Tellurides
Sulfides
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Bonding & Backing Plate
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Indium Metal - We use pure Indium metal as the bonding agent , the melting
point for Indium is 156 °C , this may limit the amount of power during
sputtering process .
Silver Epoxy – We use Ag epoxy as the bonding agent for ceramic target
that require a higher melting point .
Backing Plate – Oxygen free copper is the most common backing plate
material , due to it's excellent thermal properties .
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Popular Ceramic Targets
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Sputter Target
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Formula
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Purity ( % )
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Method
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ITO
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In2O3 / SnO2
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99.99
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Hot pressing
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IZO
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In2O3 / ZnO
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99.99
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Hot pressing
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Aluminum oxide
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Al2O3
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99.99
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Hot pressing
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Titanium carbide
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TiC
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99.90
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Hot pressing
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BST
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BaxSr(1-x)TiO3
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99.99
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Hot pressing
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PZT
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Pb(Zr0.52Ti0.48)O3
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99.99
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Hot pressing
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Titanium dioxide
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TiO2
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99.90
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Hot pressing
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YBCO
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YBa2Cu3Ox
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99.99
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Hot pressing
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YSZ
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ZrO2 / Y2O3
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99.99
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Hot pressing
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ZAO
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ZnO / Al2O3
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99.99
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Hot pressing
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ZGO
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ZnO / Ga2O3
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99.99
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Hot pressing
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Zinc oxide
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ZnO
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99.99
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Hot pressing
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Impurity Content for ITO Sputter Target
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Element
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Al
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Ba
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Cd
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Cu
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Fe
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Ni
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Pb
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Sb
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Si
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Zn
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Content ( ppm )
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5
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5
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5
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10
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10
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10
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10
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5
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15
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5
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Pure Element Sputter Target
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Rare Earth Sputter Target
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Formula
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Purity
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Materials
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Formula
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Purity
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Materials |
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Ag
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4N
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Silver
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Ce
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3N
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Cerium |
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Al
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5N
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Aluminum
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Dy
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3N
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Dysprosium |
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B
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3N
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Boron
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Er
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3N
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Erbium |
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Bi
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3N
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Bismuth
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Eu
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3N
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Europium |
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C
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3N
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Carbon
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Gd
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3N
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Gadolinium |
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Co
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3N
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Cobalt
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Ho
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3N
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Holmium |
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Cr
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3N
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Chromium
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La
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3N
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Lanthanum |
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Cu
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4N
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Copper
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Lu
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3N
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Lutetium |
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Fe
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4N
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Iron
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Nd
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3N
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Neodymium |
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Ge
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5N
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Germanium
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Pm
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3N
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Promethium |
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Hf
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3N
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Hafnium
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Pr
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3N
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Praseodymium |
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In
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4N
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Indium
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Sm
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3N
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Samarium |
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Mg
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3N
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Magnesium
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Tb
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3N
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Terbium |
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Mn
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4N
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Manganese
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Tm
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3N
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Thulium |
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Mo
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4N
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Molybdenum
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Yb
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3N
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Ytterbium |
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Nb
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3N
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Niobium
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Ni
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4N
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Nickel
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Pb
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5N
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Lead
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Sb
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5N
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Antimony
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Si
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5N
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Silicon
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Sn
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5N
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Tin
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Ta
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3N
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Tantalum
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Te
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4N
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Tellurium
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Ti
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4N
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Titanium
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V
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3N
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Vanadium
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W
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3N
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Tungsten
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Y
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3N
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Yttrium
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Zn
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5N
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Zinc
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Zr
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3N
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Zirconium
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Applications
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Semiconductor
Decorative
Hard coating
Solar cell
Optoelectrics
Flat panel display
Data storage
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A complete product line of sputter targets ranging from metal to compound to
serve the needs of thin film industry .
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