Semiconductor Wafer Inc

 

Sputter Targets

Semiconductor Wafer, Inc. ( SWI ) is a world wide supplier of high pure sputter targets and thin film coating materials , serving vacuum thin film industry since 2002 .

Since it's establishment , SWI is deeply involved in the thin film coating technology , especially in the fabrication and development of various sputter target materials . Today , we have enough capability to offer a wide range of sputter targets such as Pure metal , Alloy , Rare earths , Single crystals , Compounds , and various Oxide / Nitride and Carbide ceramics sputter target . Products are mainly exported to North America , Europe and Asia Pacific area .

If you are looking for a sputter target , please let us know , you can get benefits of our comprehensive fabrication know-how and technical info , we are now striving to supply our customers with high performance sputter targets at very competitive prices .

 
 
 
 
Standard Specification

Sputter target

ChoosinChoosing Materials

Purity
99.5% / 99.9% / 99.99% / 99.999%
Round shape
Diameter 1" / 2" / 3" / 4" / 6" / 8"
Square shape
Max 12 " x 12 "
Thickness
0.125" / 0.25"
Back plate
OFHC Copper
Bonding solder
Indium
Ag epoxy
 
Manufacture Methods
• Vacuum hot pressing
• Hot isostatic pressing (HIP)
• Cold isostatic pressing (CIP)
• Vacuum sintering
• Powder metallurgy
• Vacuum arc melting (VAM)
• Vacuum induction melting (VIM)
• Forging and Rolling
 
Sputter Target Available
Pure elements
Pure metals
Alloys
Rare earths
Single crystals
Compounds
Ceramics
Oxides
Borides
Carbides
Fluorides
Nitrides
Silicides
Tellurides
Sulfides
 
Bonding & Backing Plate

Indium Metal - We use pure Indium metal as the bonding agent , the melting
point for Indium is 156 °C , this may limit the amount of power during
sputtering process .

Silver Epoxy - We use Ag epoxy as the bonding agent for ceramic target
that require a higher melting point .

Backing Plate - Oxygen free copper is the most common backing plate
material , due to it's excellent thermal properties .

Popular Ceramic Targets
Sputter Target Formula Purity ( % ) Method
ITO In2O3 / SnO2 99.99 Hot pressing
IZO In2O3 / ZnO 99.99 Hot pressing
Aluminum oxide Al2O3 99.99 Hot pressing
Titanium carbide TiC 99.90 Hot pressing
BST BaxSr(1-x)TiO3 99.99 Hot pressing
PZT Pb(Zr0.52Ti0.48)O3 99.99 Hot pressing
Titanium dioxide TiO2 99.90 Hot pressing
YBCO YBa2Cu3Ox 99.99 Hot pressing
YSZ ZrO2 / Y2O3 99.99 Hot pressing
ZAO ZnO / Al2O3 99.99 Hot pressing
ZGO ZnO / Ga2O3 99.99 Hot pressing
Zinc oxide ZnO 99.99 Hot pressing
 
Impurity Content for ITO Sputter Target
Element Al Ba Cd Cu Fe Ni Pb Sb Si Zn
Content ( ppm ) 5 5 5 10 10 10 10 5 15 5
 
Pure Element Sputter Target
 
Rare Earth Sputter Target
Formula Purity Materials Formula Purity Materials
Ag 4N Silver Ce 3N Cerium
Al 5N Aluminum Dy 3N Dysprosium
B 3N Boron Er 3N Erbium
Bi 3N Bismuth Eu 3N Europium
C 3N Carbon Gd 3N Gadolinium
Co 3N Cobalt Ho 3N Holmium
Cr 3N Chromium La 3N Lanthanum
Cu 4N Copper Lu 3N Lutetium
Fe 4N Iron Nd 3N Neodymium
Ge 5N Germanium Pm 3N Promethium
Hf 3N Hafnium Pr 3N Praseodymium
In 4N Indium Sm 3N Samarium
Mg 3N Magnesium Tb 3N Terbium
Mn 4N Manganese Tm 3N Thulium
Mo 4N Molybdenum Yb 3N Ytterbium
Nb 3N Niobium      
Ni 4N Nickel      
Pb 5N Lead      
Sb 5N Antimony      
Si 5N Silicon      
Sn 5N Tin      
Ta 3N Tantalum      
Te 4N Tellurium      
Ti 4N Titanium      
V 3N Vanadium      
W 3N Tungsten      
Y 3N Yttrium      
Zn 5N Zinc      
Zr 3N Zirconium      
 
Applications
• Semiconductor
• Decorative
• Hard coating
• Solar cell
• Optoelectrics
• Flat panel display
• Data storage
 
 
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